Heat Sink Assembly

ABSTRACT

A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

CROSS REFERENCE TO RELATED APPLICATION(S)

The present application is a continuation-in-part utility applicationclaiming the benefit of U.S. patent application Ser. No. 11/073,831,filed on Mar. 7, 2005, and titled “Heat Sink Assembly,” now pending,which is hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention is generally related to heat sinks, and moreparticularly is related to an assembly for a heat sink.

2. Description of Related Art

Effective extraction of heat produced by electrical devices is importantin order to extend the useful life of these devices. A conventional heatsink device typically utilizes an array of extended surfaces, such asfins, integrally formed on a common base and projecting into ambientfluid surrounding the device. The base is placed in thermally intimatecontact with a heat producing device to provide a conduction path to thefin array. Fluid circulation, through forced or natural convection,around the fin array, acts as a heat transfer medium to cool the heatproducing device to a satisfactory operating temperature.

It is well recognized that various design parameters including fingeometry (e.g., the number of fins, fin spacing, and fin length andwidth), material selection, device characteristics, and ambientconditions, among others, influence the heat dissipation performance ofthe heat sink device (hereafter, heat sink). In certain applications, aplurality of fins arranged with predetermined dimensions, orpredetermined channel width between adjacent fins may provide optimumheat sink performance.

FIG. 1 is an exploded perspective view of a prior art heat sink assembly100. A base clip 102 removably couples a heat sink 104 to a microchip106. The base of the heat sink 104 is placed in contact with themicrochip 106. A thermally conductive layer 108 can be placed in betweenthe heat sink 104 and the microchip 106 to aid in the conduction ofheat. The base clip 102 is then placed over the top of the heat sink104. The base clip 102 couples to the bottom of the microchip 106 withtwo inward tabs 110 that frictionally fit to a bottom edge 112 of themicrochip 106.

The heat sink 104 can be replaced or removed by uncoupling the base clip102 from the microchip 106 and removing the base clip 102. Once the baseclip 102 is removed, the heat sink 104 can be removed and/or replaced.The base clip 102 is then placed over the heat sink 104 and coupled tothe microchip 106. The uncoupling and coupling of the base clip 102 tothe microchip 106 can produce stress on the microchip 106 and result indamage to the microchip 106.

Thus, a heretofore unaddressed need exists in the industry to addressthe aforementioned deficiencies and inadequacies.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a heat sink assembly mountand method of mounting a heat sink. Briefly described, in architecture,one embodiment of the heat sink assembly mount, among others, can beimplemented as follows. In one exemplary embodiment, the heat sinkassembly mount has a frame clip and a spring clip. The frame clip hasone or more inwardly extending tabs and two or more vertically extendingside portions. The one or more tabs can be sized to fit over andremovably couple to a heat producing device. A distance between the twoor more vertically extending side portions can be sized to hold a baseof a heat sink, which prevents horizontal motion of the heat sink. Thespring clip is coupled to the frame clip. The spring clip has a springbias sized to produce a vertical force pressing the heat sink againstthe heat producing device.

In another exemplary embodiment, the heat sink assembly includes a heatsink, a frame clip, and a spring clip. The heat sink has a base portionand a top fin portion. The frame clip has a top wall portion and abottom wall portion. The top wall portion has a perimeter sized toreceive the base portion of the heat sink and prevent horizontal motionof the heat sink. The bottom wall portion of the frame clip has aperimeter sized to receive a chip. The bottom wall portion also has aninwardly extending ridge with an inner ridge perimeter sized to fit overand removably couple to a heat producing device. The spring clip isremovably coupled to the frame clip and rests against the heat sink. Thespring clip has a spring bias sized to produce a vertical force pressingthe heat sink against the heat producing device.

The present invention can also be viewed as providing methods forinstalling a heat sink on a heat producing device. In this regard, oneembodiment of such a method, among others, can be broadly summarized bythe following steps: coupling the frame clip to the heat producingdevice; placing the base of the heat sink within the frame clip; placingthe spring clip over the heat sink; and coupling the spring clip to theframe clip.

Other systems, methods, and advantages of the present invention will beor become apparent to one with skill in the art upon examination of thefollowing drawings and detailed description. It is intended that allsuch additional systems, methods, features, and advantages be includedwithin this description, be within the scope of the present invention,and be protected by the accompanying claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the invention can be better understood with reference tothe following drawings. The components in the drawings are notnecessarily to scale, emphasis instead being placed upon clearlyillustrating the principles of the present invention. Moreover, in thedrawings, like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 is an exploded perspective view of a prior art heat sinkassembly.

FIG. 2 is an exploded perspective view of a heat sink assembly inaccordance with a first exemplary embodiment.

FIG. 3 is an assembled perspective view of the heat sink assembly inaccordance with the first exemplary embodiment.

FIG. 4 is a side profile view of the heat sink assembly in accordancewith the first exemplary embodiment.

FIG. 5 is a top plane view of the heat sink assembly in accordance withthe first exemplary embodiment.

FIG. 6 is a perspective view of the frame clip in accordance with thefirst exemplary embodiment.

FIG. 7 is a top plane view of the frame clip in accordance with thefirst exemplary embodiment.

FIG. 8 is a side profile view of the frame clip in accordance with thefirst exemplary embodiment.

FIG. 9 is an exploded perspective view of a heat sink assembly inaccordance with a second exemplary embodiment.

FIG. 10 is an assembled perspective view of the heat sink assembly inaccordance with the second exemplary embodiment.

FIG. 11 is a side profile view of the heat sink assembly in accordancewith the second exemplary embodiment.

FIG. 12 is a top plane view of the heat sink assembly in accordance withthe second exemplary embodiment.

FIG. 13 is a perspective view of the frame clip in accordance with thesecond exemplary embodiment.

FIG. 14 is a top plane view of the frame clip in accordance with thesecond exemplary embodiment.

FIG. 15 is a side profile view of the frame clip in accordance with thesecond exemplary embodiment.

FIG. 16 is an exploded perspective view of a heat sink assembly inaccordance with a third exemplary embodiment.

FIG. 17 is an assembled perspective view of the heat sink assembly inaccordance with the third exemplary embodiment.

FIG. 18 is a side profile view of the heat sink assembly in accordancewith the third exemplary embodiment.

FIG. 19 is a top plane view of the heat sink assembly in accordance withthe third exemplary embodiment.

FIG. 20 is a front profile view of the heat sink assembly in accordancewith the third exemplary embodiment.

FIG. 21 is a perspective view of the frame clip in accordance with thethird exemplary embodiment.

FIG. 22 is a top plane view of the frame clip in accordance with thethird exemplary embodiment.

FIG. 23 is a side profile view of the frame clip in accordance with thethird exemplary embodiment.

FIG. 24 is a front profile view of the frame clip in accordance with thethird exemplary embodiment.

FIG. 25 is an assembled perspective view of a heat sink assembly inaccordance with a fourth exemplary embodiment.

FIG. 26 is a side profile view of the heat sink assembly in accordancewith the fourth exemplary embodiment.

FIG. 27 is a top plane view of the heat sink assembly in accordance withthe fourth exemplary embodiment.

FIG. 28 is a perspective view of the frame clip in accordance with thefourth exemplary embodiment.

FIG. 29 is a top plane view of the frame clip in accordance with thefourth exemplary embodiment.

FIG. 30 is a side profile view of the frame clip in accordance with thefourth exemplary embodiment.

FIG. 31 is a front profile view of the frame clip in accordance with thefourth exemplary embodiment.

FIG. 32 is a flow-chart illustrating a method for making the apparatusof the present invention in accordance with the first exemplaryembodiment.

FIG. 33 is an exploded perspective view of a frame clip in accordancewith a fifth exemplary embodiment.

FIG. 34 is an assembled perspective view of the frame clip in accordancewith a fifth exemplary embodiment.

FIG. 35 is an exploded perspective view of the heat sink assembly inaccordance with a sixth exemplary embodiment.

FIG. 36 is an assembled perspective view of the heat sink assembly inaccordance with the sixth exemplary embodiment.

FIG. 37 is a perspective view of the frame clip and spring clip inaccordance with the sixth exemplary embodiment.

DETAILED DESCRIPTION

FIG. 2 and FIG. 3 are, respectively, an exploded and assembledperspective view of a heat sink assembly 200 in accordance with a firstexemplary embodiment of the invention. The heat sink assembly 200 has aframe clip 202 and a spring clip 204. A heat producing device 206 can becoupled to a board 208, such as a printed circuit board, or othersupport structure. The board 208 can be, for example, but not limitedto, a motherboard or other component that can be coupled to the heatproducing device 206. The heat producing device 206 can be a variety ofdevices, for example, an integrated circuit or a variety of otheroptical or electrical components. A heat sink 210 is used to dissipateheat from the heat producing device 206. The heat sink 210 has a base209 portion and a top fin 211 portion. Individual fins 211 may vary inlength and individual fins 211 may be at varying angles with respect tothe base 209. The heat sink 210 can be positioned against the heatproducing device 206. The heat is transferred from the heat producingdevice 206 to the heat sink 210 by conduction. A thermally conductivelayer 212 can be placed in between the heat sink 210 and the heatproducing device 206 to aid in the conduction of heat.

The frame clip 202 fits over the heat producing device 206. Tabs 214extend from a base 216 of the frame clip 202 and couple to a bottom edge218 of the heat producing device 206. The heat sink 210 fits within theframe clip 202. The spring clip 204 removably couples to the frame clip202. The base 216 of the frame clip 202 can rest against the board 208.The frame clip 202 can be used to transfer the weight, or any forcesdistributed to the heat sink 210, directly to the board 208 instead ofpassing through the heat producing device 206. For example, anaccidental jarring of the heat sink 210 can be transferred to the board208 and prevent unwanted application of forces to the heat producingdevice 206 and potentially damaging the heat producing device 206. Itshould be noted that the spring clip 204 does not touch the board 208and the spring clip 204 is directly attached to the frame clip 202.Alternatively, one having ordinary skill in the art, may provide amanner of using the spring clip 204, wherein the spring clip 204 doestouch the board 208.

Once the heat sink 210 is positioned within the frame clip 202, thespring clip 204 is coupled to the top of the frame clip 202, asexplained below. According to the first exemplary embodiment, the springclip is a “Z-shaped” clip. Once the spring clip 204 is coupled on top ofthe frame clip 202, the spring clip 204 exerts a force on the heat sink210. The force presses the heat sink 210 against the heat producingdevice 206. The force assists the heat sink 210 in maintaining contactwith the heat producing device 206 and facilitating the conduction ofheat from the heat producing device 206.

The spring clip 204 can be made of a variety of elastic materials forexample, but not limited to, plastics, metals, or composites. The springclip 204 has a spring bias sized to produce a vertical force pressingthe heat sink 210 against the heat producing device 206.

FIGS. 4 and 5 are, respectively, a side and top profile view of the heatsink assembly 200 in accordance with the first exemplary embodiment. Thespring clip 204, according to the first exemplary embodiment, has a“Z-shape.” The “Z-shaped” spring clip 204 has a first end 502 thatcouples to a first edge 504 of the frame clip 202 and a second end 506that couples to a second opposite edge 508 of the frame clip 202. Thefirst end 502 of the spring clip 204 is pressed in a downward direction,as shown by the clockwise-curved arrow in FIG. 4, and coupled underneaththe first edge 504 of the frame clip 202. Similarly, the second end 506of the spring clip 204 is coupled underneath the second opposite edge508 of the frame clip 202. Notches 402 can be provided in edges 504, 508to prevent the spring clip 204 from shifting horizontally. Coupling thefirst end 502 of the spring clip 204 and second end 506 of the springclip 204 to the frame clip 202 puts the spring clip 204 in tension andpresses a mid-section 510 of the spring clip 204 against the heat sink210.

FIGS. 6, 7, and 8, respectively, are a perspective view, top plane view,and side profile view of the frame clip 202 in accordance with the firstexemplary embodiment. The frame clip 202 fits over the heat producingdevice 206. Two or more tabs 214 extend from a base 216 of the frameclip 202 and couple to a bottom edge 218 of the heat producing device206. The tabs 214 can be positioned opposite each other, or at alocation along wall of the base 216, to allow the frame clip 202 tosecurely couple to the heat producing device 206. The opposing tabs 214can be spaced a distance apart to allow the base 216 of the frame clip202 to fit over a top of the heat producing device 206 in an extended orstretched position, while producing a frictional fit to the bottom edgeof the heat producing device 206 in a relaxed condition. It should benoted that a modern low profile heat producing device 206 may be grippedby four or more tabs 214 on the frame clip 202, thereby maintaining theposition of the low profile heat producing device 206 within the frameclip 202. Alternatively, positioning tabs 214, in specific locations ofthe frame clip 202 may result in the same function of maintaining theposition of the low profile heat producing device 206 within the frameclip 202. It should be noted that, there is no requirement that four ormore tabs 214 be used to maintain the position of the low profile heatproducing device 206 within the frame clip 202. Instead, positioning thetabs 214 in specific locations of the frame clip 202, even with fewerthan four tabs 214, may result in the same function of maintaining theposition of the low profile heat producing device 206 within the frameclip 202.

The invention is not limited to the tab structures shown in FIGS. 2-8. Avariety of other structures can be used, for example, but not limitedto, ridges, protrusion or a frictional fit against the walls of the base216 of the frame clip 202. The tab structure is not limited to twoopposing tabs 214 as shown in FIG. 7. The tab 214 is shown to riseabruptly from the base 216 as shown but the tab 214 may also rise in atapering manner, depending on a given application, from the base 216.The tab structure may have one or more tabs 214 in addition to the twoopposing tabs 214. Additionally, the invention is not limited to thetabs 214 fitting underneath the heat producing device 206. The tabs 214may, for example, couple to indentations or ridges (not shown) on theside of the heat producing device 206, or various platforms placed onthe printed circuit board (board 208) itself, or form a frictional fitagainst the side walls of the heat producing device 206.

FIG. 9 and FIG. 10 are, respectively, an exploded and assembledperspective view of a heat sink assembly 900 in accordance with a secondexemplary embodiment of the invention. The heat sink assembly 900 has aframe clip 902 and a spring clip 904. A heat producing device 906 can becoupled to a board or other support structure (not shown). A heat sink910 is used to dissipate heat from the heat producing device 906. Theheat sink 910 has a base 909 portion and a top fin 911 portion.Individual fins 911 may vary in length and individual fins 911 may be atvarying angles with respect to the base 909. The heat sink 910 can bepositioned against the heat producing device 906. The heat istransferred from the heat producing device 906 to the heat sink 910 byconduction. A thermally conductive layer 912 can be placed in betweenthe heat sink 910 and the heat producing device 906 to aid in theconduction of heat.

The frame clip 902 of the second exemplary embodiment fits over the heatproducing device 906. Tabs 914 extend from a base 916 of the frame clip902 and couple to a bottom edge 918 of the heat producing device 906.The heat sink 910 fits within the frame clip 902. The spring clip 904removably couples to the frame clip 902 as explained below.

Once the heat sink 910 is positioned within the frame clip 902, thespring clip 904 is coupled to the top of the frame clip 902. Accordingto the second exemplary embodiment, the spring clip 904 is an “M-shaped”clip. Once the spring clip 904 is coupled on top of the frame clip 902,the spring clip 904 exerts a force on the heat sink 910. The force isexerted in a downward direction, pressing the heat sink 910 against theheat producing device 906. The force assists the heat sink 910 inmaintaining contact with the heat producing device 906 and facilitatingthe conduction of heat from the heat producing device 906.

The spring clip 904 of the second exemplary embodiment can be made of avariety of elastic materials, for example, but not limited to, plastics,metals, or composites. The spring clip 904 has a spring bias sized toproduce a vertical force pressing the heat sink 910 against the heatproducing device 906.

FIG. 11 and FIG. 12 are, respectively, a side cross-sectional view andtop profile view of the heat sink assembly 900 in accordance with thesecond exemplary embodiment. In FIG. 11, the fins 911 are not shown tofacilitate a clearer illustration of the spring clip 904. The “M-shaped”spring clip 904 has a first end 1102 that couples to a first handle 1104of the frame clip 902 and a second end 1106 that couples to a secondhandle 1108 of the frame clip 902. The first end 1102 of the spring clip904 is threaded through the first handle 1104 of the frame clip 902. Thesecond end 1106 of the spring clip 904 is pressed in a down and inwarddirection, as shown by the arrow in FIG. 11, and coupled underneath thesecond handle 1108 of the frame clip 902. Coupling the first end 1102and second end 1106 to the frame clip 902 puts the spring clip 904 intension and presses a mid-section 1110 of the spring clip 904 againstthe heat sink 910. The first handle 1104 and second handle 1108 of theframe clip 902 are not limited to the exemplary structures shown inFIGS. 9-15. A variety of other handle structures can be provided tocouple the first end 1102 and the second end 1106 of the spring clip904. As an example, the first end 1102 and second end 1106 of the springclip 904 may extend inward and clip to a ridge (not shown) underneaththe frame clip 902.

FIGS. 13, 14, and 15, respectively, are a perspective view, top planeview, and side profile view of the frame clip 902, in accordance withthe second exemplary embodiment. The frame clip 902 fits over the heatproducing device 906. Two or more tabs 914 extend from a base 916 of theframe clip 902 and couple to a bottom edge 918 of the heat producingdevice 906. The tabs 914 can be positioned opposite each other to allowthe frame clip 902 to securely couple to the heat producing device 906.The opposing tabs 914 can be spaced a distance apart to allow the base916 of the frame clip 902 to fit over a top of the heat producing device906 in an extended or stretched position, while producing a frictionalfit to the bottom edge 918 of the heat producing device 906 in a relaxedcondition. The invention is not limited to the tab structures shown inFIGS. 9-15. A variety of other structures can be used, e.g., the tab 914is shown to rise abruptly from the base 916 but the tab 914 may alsorise in a tapering manner, depending on a given application, from thebase 916.

FIG. 16 and FIG. 17 are, respectively, an exploded and assembledperspective view of a heat sink assembly 1600, in accordance with athird exemplary embodiment of the invention. The heat sink assembly 1600has a frame clip 1602 and a spring clip 1604. A heat producing device1606 can be coupled to a board 1608 or other support structure. Theboard 1608 can be a variety of other devices. A heat sink 1610 is usedto dissipate heat from the heat producing device 1606. The heat sink1610 has a base 1609 portion and a top fin 1611 portion. Individual fins1611 may vary in length and individual fins 1611 may be at varyingangles with respect to the base 1609. The heat sink 1610 can bepositioned against the heat producing device 1606. Heat is transferredfrom the heat producing device 1606 to the heat sink 1610 by conduction.A thermally conductive layer 1612 can be placed between the heat sink1610 and the heat producing device 1606 to aid in the conduction ofheat.

The frame clip 1602 of the third exemplary embodiment fits over the heatproducing device 1606. Tabs 1614 extend from a base 1616 of the frameclip 1602 and couple to a bottom edge 1618 of the heat producing device1606. A base 1620 of the heat sink 1610 fits within the frame clip 1602.The spring clip 1604 rotatably couples to the frame clip 1602. The base1616 of the frame clip 1602 can rest against the 1608 board. The frameclip 1602 can prevent the transfer of weight or accidental forces placedon the heat sink 1610. Once the base 1620 of the heat sink 1610 ispositioned within the frame clip 1602, the spring clip 1604 is rotatableabout the top of the frame clip 1602. According to the third exemplaryembodiment, the spring clip 1604 is an “M-shaped” clip that is rotatablycoupled to the frame clip 1602. Once the spring clip 1604 is coupled ontop of the frame clip 1602, the spring clip 1604 exerts a force on theheat sink 1610. The force presses the heat sink 1610 against the heatproducing device 1606. The force assists the heat sink 1610 inmaintaining contact with the heat producing device 1606 and facilitatingthe conduction of heat from the heat producing device 1606. The springclip 1604 has a spring bias sized to produce a vertical force pressingthe heat sink 1610 against the heat producing device 1606. The springclip 1604 of the third exemplary embodiment can be made of a variety ofelastic materials, for example, but not limited to, plastics, metals, orcomposites.

FIGS. 18, 19, and 20 are, respectively, a side, top, and front profileview of the heat sink assembly 1600 in accordance with the thirdexemplary embodiment. The “M-shaped clip” 1604 has a first end 1802 thatrotatably couples to a first handle 1804 of the frame clip 1602 and asecond end 1806 that removably couples to a second opposite handle 1808of the frame clip 1602. The first end 1802 is hinged to the first handle1804. The hinging of the first end 1802 as shown in the third exemplaryembodiment is an example of a hinge that may be used; other hingingstructures can be used and are within the scope of the invention. Thesecond end 1806 is pressed in a down and inward direction, as shown bythe arrow in FIG. 18, and coupled underneath the second handle 1808 ofthe frame clip 1602. Coupling the first end 1802 and second end 1806 tothe frame clip 1602 puts the spring clip 1604 in tension and presses amid-section (not shown) of the spring clip 1604 against the heat sink1610. The first handle 1804 and second handle 1808 are not limited tothe exemplary structures shown in FIGS. 16-24. A variety of other handlestructures can be provided to couple the first end 1802 and the secondend 1806 of the spring clip 1604.

FIGS. 21, 22, 23, and 24, respectively, are a perspective view, topplane view, side profile view, and front profile view of the frame clip1602 in accordance with the third exemplary embodiment. The frame clip1602 fits over the heat producing device 1606. Two or more tabs 1614extend from a base 1616 of the frame clip 1602 and couple to a bottomedge 1618 of the heat producing device 1606. The tabs 1614 can bepositioned opposite each other to allow the frame clip 1602 to securelycouple to the heat producing device 1606. The distance between theopposing tabs 1614 can be spaced a distance apart to allow the base 1616of the frame clip 1602 to fit over top of the heat producing device 1606in an extended or stretched position, while producing a frictional fitto the bottom edge 1618 of the heat producing device 1606 in a relaxedcondition. The invention is not limited to the tab structures shown inFIGS. 16-24. A variety of other tab structures can be used, e.g., thetab 1614 is shown to rise abruptly from the base 1616 but the tab 1614may also rise in a tapering manner, depending on a given application,from the base 1616.

FIGS. 25, 26 and 27 are, respectively, an assembled perspective view, aside profile view and top plane view of a heat sink assembly 2500 inaccordance with a fourth exemplary embodiment. The heat sink assembly2500 has a frame clip 2502 and a spring clip 2504. The spring clip 2504may be a side-coupled spring clip. A heat producing device 2506 can becoupled to a board 2508 or other support structure. Similar to the firstexemplary embodiment, the heat producing device 2506 of the fourthexemplary embodiment can be a variety of devices. A heat sink 2510 isused to dissipate heat from the heat producing device 2506. The heatsink 2510 has a base portion 2509 and a top fin 2511 portion. Individualfins 2511 may vary in length and individual fins 2511 may be at varyingangles with respect to the base 2509. The heat sink 2510 can bepositioned against the heat producing device 2506. Heat is transferredfrom the heat producing device 2506 to the heat sink 2510 by thermalconduction. A thermally conductive layer (not shown) can be placed inbetween the heat sink 2510 and the heat producing device 2506 to aid inthe conduction of heat.

The frame clip 2502 of the fourth exemplary embodiment fits over theheat producing device 2506. Tabs 2514 extend from a base 2516 of theframe clip 2502 and couple to a bottom edge 2518 (as shown in FIGS.28-30) of the heat producing device 2506. A base 2509 (not shown) of theheat sink 2510 fits within the frame clip 2502. The spring clip 2504removably couples to the frame clip 2502. The base 2516 of the frameclip 2502 can rest against the board 2508. The frame clip 2502 canprevent the transfer of weight or accidental forces placed on the heatsink 2510.

Once the heat sink 2510 is positioned within the frame clip 2502, thespring clip 2504 is coupled to the top of the frame clip 2502. Accordingto the fourth exemplary embodiment, the spring clip 2504 can include oneor more side-coupled spring clips 2504. Once the spring clip 2504 iscoupled to the frame clip 2502, the spring clip 2504 exerts a force onthe heat sink 2510. The force is exerted toward the heat producingdevice 2506, pressing the heat sink 2510 against the heat producingdevice 2506. The force assists the heat sink 2510 in maintaining contactwith the heat producing device 2506 and facilitates the conduction ofheat from the heat producing device 2506.

The spring clip 2504 of the fourth exemplary embodiment can be made of avariety of elastic materials, for example, but not limited to, plastics,metals, or composites. The spring clip 2504 has a spring bias sized toproduce a vertical force pressing the heat sink 2510 against the heatproducing device 2506. Each side-coupled spring clip 2504 is a portionof doubled-over material 2504A with a slot in the center of the material2504A. A fastener 2504B extends through the slot and couples the springclip 2504 to the frame clip 2502. The fasteners 2504B can be a varietyof mechanical fasteners, for example, but not limited to, screws, pinsor brackets. In the fourth exemplary embodiment, the fastener 2504B is ascrew. The screw type fastener 2504B allows the tension of the springclip 2504 to be adjusted by tightening or loosening the screw, therebyaltering the force exerted on the heat sink 2510 and heat producingdevice 2506.

FIGS. 28, 29, 30, and 31, respectively, are a perspective view, topplane view, side profile view, and front profile view of the frame clip2502 in accordance with the fourth exemplary embodiment. The frame clip2502 fits over the heat producing device 2506. Two or more tabs 2514extend from the base 2516 of the frame clip 2502 and couple to thebottom edge 2518 of the heat producing device 2506. The tabs 2514 can bepositioned opposite each other to allow the frame clip 2502 to securelycouple to the heat producing device 2506. The distance between theopposing tabs 2514 can be spaced a distance apart to allow the base 2516of the frame clip 2502 to fit over top of the heat producing device 2506in an extended or stretched position, while producing a frictional fitto the bottom edge 2518 of the heat producing device 2506 in a relaxedcondition. The invention is not limited to the tab structures 2514 orthe frame clip 2502 shape as shown in FIGS. 28-30. A variety of othertab structures can be used, e.g., the tab 2514 is shown to rise abruptlyfrom the base 2516 but the tab 2514 may also rise in a tapering manner,depending on a given application, from the base 2516.

Any process descriptions or blocks in flow charts should be understoodas representing modules, segments or portions of code which include oneor more executable instructions for implementing specific logicalfunctions or steps in the process, and alternate implementations areincluded within the scope of the preferred embodiment of the presentinvention in which functions may be executed out of order from thatshown or discussed, including substantially concurrently or in reverseorder, depending on the functionality involved, as would be understoodby one of ordinary skill in the art of the invention.

The first exemplary embodiment of the invention can be implemented usingthe following method 3000 as shown in the flow-chart of FIG. 32. Theframe clip 202 is removably coupled to the heat producing device 206(Block 3002). A base 209 of the heat sink 210 is placed within the frameclip 202 (Block 3004). A spring clip 204 is placed over the heat sink210 (Block 3006) and coupled to the frame clip 202 (Block 3008). Thecoupled spring clip 204 exerts a force on the heat sink 210 thatmaintains contact between the heat sink 210 and the heat producingdevice 206. The heat sink assembly 200 allows an individual to changethe heat sink 210 by removing the spring clip 204 and the previouslyinstalled heat sink 210. The individual places a new heat sink 210within the frame clip 202 and couples the spring clip 204 back onto theframe clip 202. The frame clip 202 is not removed from the heatproducing device 206, limiting stress on the heat producing device 206during an event of changing the heat sink 210.

FIG. 33 is an exploded perspective view of the frame clip 2702 inaccordance with a fifth exemplary embodiment of the invention. The frameclip 2702 fits over a heat producing device 2506, as illustrated in FIG.26. The frame clip 2702 has a tab 2714 on each of the four sides of theframe clip 2702 as shown in FIG. 33. Two of the tabs 2714 are notvisible in FIG. 33. It should be noted that the location of each tab2714 on a side of the frame clip 2702 may vary along the side of theframe clip 2702, from an essentially middle location shown in the FIG.33. The frame clip 2702 also features a slot 2718, in each of the sidesof the frame clip 2702, to accommodate a spring stiffener 2716. As anexample, if a frame clip 2702 has four sides, the frame clip 2702 mayhave four slots 2718 and four spring stiffeners 2716. The function ofthe spring stiffener 2716 is to maintain pressure of the frame clip 2702on a heat producing device 2506 (FIG. 26) by resisting effects oftemperature cycling encountered in an application.

FIG. 34 is an assembled perspective view of the frame clip 2702 of FIG.33, in accordance with the fifth exemplary embodiment of the invention.FIG. 34 illustrates the four tabs 2714, of which two are visible, andthe spring stiffeners 2716 inserted into the slots 2718. In a usualapplication, the frame clip 2702 will first be attached to a heatproducing device 2506 (FIG. 26) followed by insertion of the springstiffeners 2716.

FIG. 35 and FIG. 36 are, respectively, an exploded and assembledperspective view of the heat sink assembly 4000 in accordance with sixthexemplary embodiment. The heat sink assembly 4000 has a frame clip 4005and a spring clip 4004. A heat producing device 4002 can be coupled to aboard 4003, which may be implemented as a support structure such as aprinted circuit board. FIG. 37 shows, respectively, a perspective viewof the spring clip 4004 and the frame clip 4005 in accordance with thesixth exemplary embodiment.

The frame clip 4005 fits over the heat producing device 4002. The fourtabs 4005D extend from the base of the frame clip 4005 and couple to abottom edge 4002A of the heat producing device 4002. The heat sink 4001fits within the frame clip 4005 such that its movement in the plane ofthe surface of the heat producing device 4002 is constrained by the foursink stops 4005B. The outer surface of the sink stops 4005B on the topsurface of the frame clip 4005 are sloped downward toward the board 4003to aid in the installation of the spring clip 4004. The outer bottomsurfaces 4005C of the frame clip 4005 are sloped inward toward the heatproducing device 4002 to minimize the area of contact between the frameclip 4005 and the board 4003. This feature aids in the placement ofadjacent components on the board 4003. The symmetric design of the frameclip 4005 eliminates potential errors in orientation when attached tothe heat producing device 4002.

The spring clip 4004 removably couples to the frame clip 4005. The outeredge 4004A of the spring clip 4004 is locked to the heat sink assemblyusing the outer edge 4005A of the frame clip 4005. The two loadingsurface 4004B on the bottom of the spring clip 4004 apply force to theheat sink 4001. The spring clip 4004 can be made of a variety of elasticmaterials for example, but not limited to, plastics, metals, orcomposites. The spring clip 4004 has a spring bias sized to produce avertical force pressing the heat sink 4001 against the heat producingdevice 4002. In one embodiment, the spring clip can be made of a varietyof elastic materials including, but not limited to plastics, metals, orcomposites. The spring clip 4004 has a spring bias sized to produce avertical force pressing the heat sink 4001 against the heat producingdevice 4002.

It should be emphasized that the above-described embodiments of thepresent invention are merely possible examples of implementations,merely set forth for a clear understanding of the principles of theinvention. Many variations and modifications may be made to theabove-described embodiments of the invention without departingsubstantially from the spirit and principles of the invention. Differentaspects of the various exemplary embodiments may be incorporatedtogether or in combination with other exemplary embodiment. All suchmodifications and variations are intended to be included herein withinthe scope of this disclosure and the present invention and protected bythe following claims.

1. A heat sink assembly mount, comprising: a frame clip having a toparea and a bottom area, at least one inwardly extending tab on each offour sides of the bottom area; a plurality of vertically extending sideportions adjacent to the top area, wherein the side portions of theframe clip are sloped inward toward a heat producing device; the bottomarea of the frame clip sized to stretch and fit over and underneath theheat producing device in a stretched condition; the top of the clipsized to couple to said heat producing device in a relaxed conditionwith a distance between oppositely disposed vertically extending sideportions sized to hold a base of a heat sink, thereby preventinghorizontal motion of the heat sink, wherein the heat sink is removablefrom the frame clip absent removal of said frame clip from said heatproducing device; and a spring clip to fit between heat sink fins andcoupled to the frame clip, wherein the spring clip has a spring biassized to produce a vertical force pressing the heat sink against theheat producing device.
 2. The heat sink assembly of claim 1, furthercomprising a sink stop tab on an upper surface of a top wall portion toconstrain lateral motion of the heat sink relative to the heat producingdevice.
 3. The heat sink assembly mount of claim 2, wherein the springclip is “Z-shaped” and removably couples to a top outwardly extendingridge on each of the vertically extending side portions.
 4. The heatsink assembly mount of claim 2, wherein the spring clip is “M-shaped”having a first end of the spring clip removably coupled to a firsthandle extending from the frame clip and a second end of the spring clipremovably coupled to a second handle extending from the frame clip. 5.The heat sink assembly mount of claim 2, wherein the spring clip is“M-shaped” having a first end removably coupled to a first handleextending from the frame clip and a second end rotatably coupled to asecond handle extending from the frame clip.
 6. The heat sink assemblymount of claim 2, wherein the spring clip is at least one side-coupledspring clip with removable fasteners coupling each side clip to thevertically extending side portions of the frame clip.
 7. The heat sinkassembly mount of claim 2, wherein the tabs are sized to produce africtional fit coupling to the heat producing device.
 8. The heat sinkassembly mount of claim 2, wherein the tabs are sized to fit within anindentation on the heat producing device.
 9. The heat sink assemblymount of claim 2, wherein the tabs are positioned so as to preventhorizontal movement between the heat producing device and the frameclip.
 10. The heat sink assembly mount of claim 2, wherein the frameclip has at least one slot therein, said slot being capable ofaccommodating a spring stiffener, thereby maintaining stability of theframe clip.
 11. A heat sink assembly comprising: a heat sink having abase portion in communication with fins extending from a top sidethereof; a frame clip comprising: a top wall portion with a perimetersized to receive the base portion of the heat sink and to preventhorizontal motion of the heat sink; and a bottom wall portion with aperimeter sized to receive a heat producing device, the bottom wallportion having an inwardly extending ridge on all four sides of thebottom portion, said bottom wall portion sized to fit over said heatproducing device in a stretched condition and removably couple in arelaxed condition to said heat producing device, wherein the heat sinkis removable from the frame clip absent removal of said frame clip fromsaid heat producing device; a sink stop tab on an upper surface of thetop wall portion to constrain lateral motion of the heat sink relativeto the heat producing device; and a spring clip to fit between heat sinkfins and removably coupled to the frame clip and against the heat sinkwherein the spring clip has a spring bias sized to produce a verticalforce pressing the heat sink against the heat producing device.
 12. Theheat sink assembly of claim 11, wherein the side portions of the frameclip are sloped inward toward the heat producing device.
 13. The heatsink assembly of claim 12, wherein the spring is “Z-shaped” andremovably couples to a top outwardly extending ridge on the top wallportion.
 14. The heat sink assembly of claim 12, wherein the spring is“M-shaped” having a first end of the spring clip removably coupled to afirst handle extending from the frame clip and a second end of thespring clip removably coupled to a second handle extending from theframe clip.
 15. The heat sink assembly of claim 12, wherein the springis “M-shaped” having a first end of the spring clip removably coupled toa first handle extending from the frame clip and a second end of thespring clip rotatably coupled to a second handle extending from theframe clip.
 16. The heat sink assembly of claim 12, wherein the springclip, having a plurality of side portions, is a two-piece, side clipwith removable fasteners coupling each side clip to the plurality ofside portions of the frame clip.
 17. The heat sink assembly of claim 12,wherein a perimeter of the inwardly extending ridge is sized to producea frictional fit coupling to the heat producing device.
 17. The heatsink assembly of claim 12, wherein a perimeter of the inwardly extendingridge is sized to fit within an indentation on the heat producingdevice.
 18. The heat sink assembly of claim 12, wherein the frame cliphas a plurality of slots, said slot capable of accommodating a springstiffener.
 19. A method of installing a heat sink on a heat producingdevice, comprising the steps of: placing a frame clip over a perimeterof the heat producing device in a stretched condition and placing theframe clip over and underneath the heat producing device in a relaxedcondition, the frame clip having at least one inwardly extending tab anda sloped outer wall; fitting the heat sink within the frame clip afterthe frame clip is stretched over the heat producing device; placing abase of a heat sink into the frame clip; placing a spring clip over theheat sink between heat sink fins; and coupling the spring clip to theframe clip.
 20. The method of claim 19, further comprising constraininglateral motion of the heat sink with a sink stop tab on an upper surfaceof the frame clip.